JATTAKUL, P.; MADSA, T.; SUNASUAN, P.; MOOKAM, N. Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder. Journal of Metals, Materials and Minerals, Bangkok, Thailand, v. 31, n. 2, p. 129-136, 2021. Disponível em: http://jmmm.material.chula.ac.th/index.php/jmmm/article/view/1085. Acesso em: 26 oct. 2021.