SRIKAMONSIRISAK, S. .; TANTINUCHAWONG, U. .; SATIRAKUL, Y. Parameters optimization of copper wire bonding on thin small outline package. Journal of Metals, Materials and Minerals, Bangkok, Thailand, v. 23, n. 1, 2013. Disponível em: https://jmmm.material.chula.ac.th/index.php/jmmm/article/view/79. Acesso em: 26 apr. 2024.