JATTAKUL, Prajak, Tavee MADSA, Piyawan SUNASUAN, and Niwat MOOKAM. 2021. “Influence of Cooling Conditions on Microstructure and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder”. Journal of Metals, Materials and Minerals 31 (2). Bangkok, Thailand:129-36. http://jmmm.material.chula.ac.th/index.php/jmmm/article/view/1085.