JATTAKUL, P., MADSA, T., SUNASUAN, P. and MOOKAM, N. (2021) “Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder”, Journal of Metals, Materials and Minerals. Bangkok, Thailand, 31(2), pp. 129-136. Available at: http://jmmm.material.chula.ac.th/index.php/jmmm/article/view/1085 (Accessed: 25October2021).