1.
JATTAKUL P, MADSA T, SUNASUAN P, MOOKAM N. Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder. J. Met. Mater. Miner. [Internet]. 2021Jun.27 [cited 2021Oct.26];31(2):129-36. Available from: http://jmmm.material.chula.ac.th/index.php/jmmm/article/view/1085