WORAPAKDEE, K. .; SRISRUAL, A. High temperature storage reliability of Cu pillar flip chip interconnects. Journal of Metals, Materials and Minerals, Bangkok, Thailand, v. 36, n. 1, p. e2466, 2026. DOI: 10.55713/jmmm.v36i1.2466. Disponível em: https://jmmm.material.chula.ac.th/index.php/jmmm/article/view/2466. Acesso em: 28 jan. 2026.