Srikamonsirisak, S. ., Tantinuchawong, U. . and Satirakul, Y. (2013) “Parameters optimization of copper wire bonding on thin small outline package”, Journal of Metals, Materials and Minerals. Bangkok, Thailand, 23(1). Available at: https://jmmm.material.chula.ac.th/index.php/jmmm/article/view/79 (Accessed: 22 December 2024).