JATTAKUL, Prajak, Tavee MADSA, Piyawan SUNASUAN, and Niwat MOOKAM. “Influence of Cooling Conditions on Microstructure and Mechanical Property of Sn-0.3Ag-0.7Cu Lead-Free Solder”. Journal of Metals, Materials and Minerals 31, no. 2 (June 27, 2021): 129–136. Accessed March 2, 2024. https://jmmm.material.chula.ac.th/index.php/jmmm/article/view/1085.