WORAPAKDEE K, SRISRUAL A. High temperature storage reliability of Cu pillar flip chip interconnects. J Met Mater Miner [Internet]. 2026 Jan. 28 [cited 2026 Jan. 28];36(1):e2466. Available from: https://jmmm.material.chula.ac.th/index.php/jmmm/article/view/2466