Satirakul, Yuparwadee, Spansion (Thailand) Limited, Thailand
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Journal of Metals, Materials and Minerals Vol. 23 No. 1 (2013) - Original Research Articles
Parameters optimization of copper wire bonding on thin small outline package
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The Journal of Metals, Materials and Minerals (JMMM) | ISSN / eISSN: 0857-6149 / 2630-0508 | Responsible editors: Prof. Pranut Potiyaraj, PhD.|
This journal is published under the terms of the Creative Commons Attribution 4.0 International (CC-BY-NC-ND 4.0) by Metallurgy and Materials Science Research Institute (MMRI), Chulalongkorn University, THAILAND