Soldering of copper using graphene-phosphoric acid gel

Authors

  • Gurudatt Puranik Device Lab, Department of Physics, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India
  • Asis Sarkar Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India
  • Nirankar Mishra Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India
  • Sangam Chandrasekhar Gurumurthy Nanomaterials and Polymer Physics Lab, Department of Physics, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, Karnataka, 576104, India
  • Shridhar Mundinamani Device Lab, Department of Physics, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India

DOI:

https://doi.org/10.55713/jmmm.v30i4.721

Keywords:

Soldering flux, Carbon nanomaterials, Graphene

Abstract

Soldering is a physical process in which one metal melts and joins the other to form a strong bond, which further helps in electron conduction and increases the mechanical strength in any electronic circuits. The present work demonstrates the development of graphene-based flux comprising of 2 g of graphene and 2 ml of phosphoric acid for the residue-free, high stability, durable, and two-step soldering of copper wire on to the surface of the copper-based printed circuit board. The soldering flux can be applied to the copper, and wire can be soldered in ambient conditions using commercial soldering iron at a standard soldering temperature of 260℃. This flux helps the formation of strong and electrically conducting joints between the copper wire and copper-based printed circuit board. The joints are studied with scanning electron microscope images, and energy dispersive X-ray mapping successfully shows the formation of a joint between the copper wire and the copper and also shows the presence of graphene between the joint.

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Author Biographies

Gurudatt Puranik, Device Lab, Department of Physics, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India

Department of Mechanical Engineering, Siddaganga Institute of Technology, Tumakuru, Karnataka, INDIA-572103

Asis Sarkar, Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India

Assistant Professor, Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, INDIA-572103

Nirankar Mishra, Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India

Professor, Department of Nanotechnology, Siddaganga Institute of Technology, Tumakuru, Karnataka, INDIA-572103

Sangam Chandrasekhar Gurumurthy, Nanomaterials and Polymer Physics Lab, Department of Physics, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, Karnataka, 576104, India

Assistant Professor, Department of Physics, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, Karnataka, India - 576104

Shridhar Mundinamani, Device Lab, Department of Physics, Siddaganga Institute of Technology, Tumakuru, Karnataka, 572103, India

Assistant Professor, Department of Physics, Siddaganga Institute of Technology, Tumakuru, Karnataka, INDIA-572103

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Published

2020-12-22

How to Cite

[1]
G. Puranik, A. Sarkar, N. Mishra, S. C. Gurumurthy, and S. Mundinamani, “Soldering of copper using graphene-phosphoric acid gel”, J Met Mater Miner, vol. 30, no. 4, pp. 60–67, Dec. 2020.

Issue

Vol. 30 No. 4 (2020)

Section

Original Research Articles

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