Oxidation behavior of Sn-1 wt% Bi alloy in air and deionized water at room temperature
คำสำคัญ:
Electrochemical analysis, Thickness of tin oxide film, Oxidation of tin, X-ray photoelectron spectroscopyบทคัดย่อ
Formation of tin oxides on surface Sn-1 wt% Bi alloy lapping plates causes interactions with protrusions of embedded diamond grits, and reduces the efficiency of the lapping process. The rate and type of oxide formation were investigated to understand the problem. Electrochemical analysis was performed to characterize the oxide film thickness, and x-ray photoelectron spectroscopy was performed to characterize the tin oxide species. Oxidation in air at room temperature reaches a thickness of 23 Å after 72 h. Oxidation in deionized water at room temperature has a faster growth rate, and reaches a thickness of 33 Å after 72 h. An oxides formation model is proposed for this tin alloy composition. The first layer is either a very thin layer or comprises clusters of SnO2. The second layer is a thick and continuous SnO layer. The third layer is a mixture of the two types of oxides. Oxidation either in air or in deionized water at room temperature starts with a linear growth law, and changes to a parabolic growth law after the SnO layer reaches a critical thickness. There is a possibility of SnO to SnO2 transformation that causes thickness reduction.
Downloads
เอกสารอ้างอิง
S. Kumar, and S. Suresh, “Study of photodegradation and wetting behavior on synthesis oxides of tin (stannous and stannic),” Materialia, no. 14, pp. 100869, 2020.
A. F. James, “Tin-oxide thin films by thermal oxidation,” M.S. thesis, Department of Phy. And Ast., Western Cape Univ., Bellville, April. 2021. Accessed on: August 9, 2021. [Online]. Available: https://etd.uwc.ac.za/handle/11394/8239
D. M. Tench, M. W. Kendig, D. P.Anderson, D. D. Hillman, G. K. Lucey, and T. J. Gher, “Production Validation of SERA Solderability Test Method,” Solering & Surface Mount Technology, no. 13, pp. 46-50, 1993.
P. Bratin, M. Pavlov, G. Chalyt, and R. Gluzman, “New Application of the SERA Method Assessment of the Protective Effectiveness of Organic Solderability Preservatives,” Proceedings of the AESF annual technical conference, vol. 82, pp. 583-590, 1995.
D. T. Morgan, D. P. Anderson, and P. Kim, “Solderability assessment via sequential electrochemical reduction analysis,” Journal of Applied Electrochemistry, vol. 24, no. 1, pp. 18-29, 1994.
S. Cho, J. Yu, S.K. Kang, and D.Y. Shin, “Oxidation Study of Pure Tin and Its Alloys via Electrochemical Reduction Analysis” Journal of Electronic Materials, vol. 34, no. 5, pp. 635-642, 2005.
D. D. Hillman, and L. S. Chumbley, “Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA),” Soldering & Surface Mount Technology, vol. 18, no. 3, pp. 31-41, 2006.
S. Nakayama, T. Sugihara, T. Notoya, and T. Osakai, “Chemical
State Analysis of Tin Oxide Films by Voltammetry reduction,” Journal of The Electrochemical Society, vol. 158, no. 10, pp. C341-C345, 2011.
B. Peter, P. Michael, and C. Gene, “Evaluating Finishes Using SERA” PC FAB Magazine, May 1999, 1999.
C. L. Lau, and G. K. Wertheim, “Oxidation of tin: An ESCA study”, Journal of Vacuum Science & Technology, vol. 15, no. 2, pp. 622-624, 1978.
D. A. Asbury, and G. B. Hoflund, “A surface study of the oxidation of polycrystalline tin”, Journal of Vacuum Science & Technology A, vol. 5, no. 4, pp. 1132-1135, 1987
J. Luo, and C. Xu, “XPS Examination of Tin Oxide on Float Glass Surface” Journal of Non-Crystalline Solids, vol. 119, pp.37-40, 1990.
B. V. Crist, “A Review of XPS Data-Banks” XPS International LLC, vol. 1, pp. 1-52, 2007.
Y. Nabeta, Y. Saitoh, S. Sawada, Y. Hattori, and T. Tamami, “Growth Law of the Oxide Film Formed on the Tin Plated Contact Surface and Its Contact Resistance Characteristic”, 2009 Proceedings of the 55th IEEE Holm Conference on Electrical Contacts, pp. 176-181, 2009.
T. Tamami, Y. Nabeta, S. Sawada, and Y. Hattori, “Property of Tin Oxide Film Formed on Tin-Plated Connector Contacts”, 2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, pp. 1-8, 2010.
ดาวน์โหลด
เผยแพร่แล้ว
วิธีการอ้างอิง
ฉบับ
บท
การอนุญาต
ลิขสิทธิ์ (c) 2021 Journal of Metals, Materials and Minerals
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Authors who publish in this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgment of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgment of its initial publication in this journal.
