Electrical and water resistance properties of conductive paste based on gold/silver composites
DOI:
https://doi.org/10.55713/jmmm.v33i4.1786Keywords:
Conductive paste, Gold/Silver composite, Electrical Properties, Water resistance, Corrosive environmentsAbstract
This study aimed to investigate the effects of a corrosive environment on both the electrical and the water resistance properties of conductive paste based on gold/silver composites. The conductive paste was prepared by incorporating silver and gold powders, polyvinyl acetate, polyvinyl chloride as adhesive components, and methyl isobutyl ketone as a diluent. The gold/silver composite powder was prepared with different mass ratios of gold and silver. The paste was coated on a substrate and heated at 80℃ to form the conductive paste film. Characterizations of conductive paste were performed by using FT-IR spectroscopy, electrometry, cyclic voltammetry, and contact angle measurements. Thus, the conductive paste films were tested under two conditions: the absence and the presence of exposure to nitric acid vapor. The results showed that the resistance and the contact angle of the conductive paste were more stable after exposure to nitric acid vapor, particularly in samples of higher gold content. Furthermore, the electrochemical behavior of the conductive paste with gold content remains unchanged after exposure to nitric acid vapor. Results suggest that gold has properties in terms of stability, resistance to oxidation, and maintaining surface characteristics, making it a preferable component for applications requiring resistance to corrosive environments.
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A. Miyoshi, "Gold paste for a ceramic circuit board," U.S. Patent 6 090 436, Jul. 18, 2000.
A. Kosmala, R. Wright, Q. Zhang, and P. Kirby, "Synthesis of silver nano particles and fabrication of aqueous Ag inks for inkjet printing," Materials Chemistry and Physics, vol. 129, no. 3, pp. 1075-1080, 2011.
X. Nie, H. Wang, and J. Zou, "Inkjet printing of silver citrate conductive ink on PET substrate," Applied Surface Science, vol. 261, pp. 554-560, 2012.
J.-T. Wu, S. L.-C. Hsu, M.-H. Tsai, and W.-S. Hwang, "Conductive silver patterns via ethylene glycol vapor reduction of ink-jet printed silver nitrate tracks on a polyimide substrate," Thin Solid Films, vol. 517, no. 20, pp. 5913-5917, 2009.
Y. Mou, Y. Zhang, H. Cheng, Y. Peng, and M. Chen, "Fabrication of highly conductive and flexible printed electronics by low temperature sintering reactive silver ink," Applied Surface Science, vol. 459, pp. 249-256, 2018.
W. Cui, W. Lu, Y. Zhang, G. Lin, T. Wei, and L. Jiang, "Gold nanoparticle ink suitable for electric-conductive pattern fabrication using in ink-jet printing technology," Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol. 358, no. 1, pp. 35-41, 2010.
M. N. Nassajfar, M. Välimäki, L. Hakola, K. Eiroma, K. Immonen, M. Abdulkareem, and M. Horttanainen, "The effect of conductive ink alternation on the sustainability and functioning of printed electronics," Flexible and Printed Electronics, vol. 8, no. 2, p. 025015, 2023.
D.-Y. Shin, and Y.-R. Kim, "Comparison of contact resistivity measurements of silver paste for a silicon solar cell using TLM and CTLM," Transactions of The Korean Society of Mechanical Engineers B, vol. 38, pp. 539-545, 2014.
D. Chen, L. Zhao, H. Diao, W. Zhang, G. Wang, and W. Wang, "Choice of the low-temperature sintering Ag paste for a-Si:H/c-Si heterojunction solar cell based on characterizing the electrical performance," Journal of Alloys and Compounds, vol. 618, pp. 357-365, 2015.
A. S. Zoolfakar, M. Z. Ahmad, R. A. Rani, J. Z. Ou, S. Balendhran, S. Zhuiykov, K. Latham, W. Wlodarski, and K. Kalantar-zadeh, "Nanostructured copper oxides as ethanol vapour sensors," Sensors & Actuators, B: Chemical, vol. 185, pp. 620-627, 2013.
E. Wongrat, N. Hongsith, D. Wongratanaphisan, A. Gardchareon, and S. Choopun, "Control of depletion layer width via amount of AuNPs for sensor response enhancement in ZnO nanostructure sensor," Sensors & Actuators, B: Chemical, vol. 171-172, pp. 230-237, 2012.
S. Choopun, D. Wongratanaphisan, A. Gardchareon, and E. Wongrat, "Ethanol sensing characteristics of sensors based on ZnO:Al nanostructures prepared by thermal oxidation," in Sensors, 2012 IEEE, (Taipei, Taiwan), 2012, pp. 1-4.
M. M. Mohammadi, S. S. Gunturi, S. Shao, S. Konda, R. D. Buchner, and M. T. Swihart, "Flame-synthesized nickel-silver nanoparticle inks provide high conductivity without sintering," Chemical Engineering Journal, vol. 372, pp. 648-655, 2019.
J. M. Shaheen, and L. J. Quintana, "Conductive adhesive for providing electrical and thermal conductivity," U.S. Patent 4 147 669, Apr. 3, 1979.
H.-M. Ren, K. Zhang, Y. M. F. Matthew, X.-Z. Fu, R. Sun, and C.-P. Wong, "Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives," Journal of Solid State Lighting, vol. 1, no. 1, p. 10, 2014.
Y. Chao, H. Yang, Y. Li, S. Guo, C. Wang, and C. Wang, "Rapid synthesis of irregular sub-micron flaky silver with high flake-particle ratio: Application to silver paste," Chemical Physics Letters, vol. 708, pp. 183-187, 2018.
N. Li, J. Li, X. Wan, Y. Niu, Y. Gu, G. Chen, and S. Ju, "Preparation of micro-size spherical silver particles and their application in conductive silver paste," Materials, vol. 16, no. 4, p. 1733, 2023.
O. Yusuke, "Development and Application of Low-temperature curable isotropic conductive adhesive toward to fabrication in iot generation," in Applied Adhesive Bonding in Science and Technology, Ö. Halil Ed. Rijeka: IntechOpen, 2017, p. Ch. 3.
M. I. Kim, E. B. Choi, and J.-H. Lee, "Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles," Journal of Materials Research and Technology, vol. 9, no. 6, pp. 16006-16017, 2020.
Y. Lai, S. Zhu, J. Li, H. Zhang, and T. Qi, "One-step synthesis of micro-sized flake silver particles as electrically conductive adhesive fillers in printed electronics," Journal of Industrial and Engineering Chemistry, vol. 121, pp. 77-91, 2023.
K. Park, D. Seo, and J. Lee, "Conductivity of silver paste prepared from nanoparticles," Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol. 313-314, pp. 351-354, 2008.
R. Aradhana, S. Mohanty, and S. K. Nayak, "A review on epoxy-based electrically conductive adhesives," International Journal of Adhesion and Adhesives, vol. 99, p. 102596, 2020.
Z. Czech, R. Pełech, A. Kowalczyk, A. Kowalski, and R. Wróbel, "Electrically conductive acrylic pressure-sensitive adhesives containing carbon black," Polish Journal of Chemical Technology, vol. 13, no. 4, pp. 77-81, 2012.
U. Khan, P. May, H. Porwal, K. Nawaz, and J. N. Coleman, "Improved adhesive strength and toughness of polyvinyl acetate glue on addition of small quantities of graphene," ACS Applied Materials & Interfaces, vol. 5, no. 4, pp. 1423-1428, 2013.
H. R. Taghiyari, R. Majidi, S. M. M. Armaki, and M. Haghighatparast, "Graphene as reinforcing filler in polyvinyl acetate resin," International Journal of Adhesion and Adhesives, vol. 113, p. 103075, 2022.
B. I. Cherifi, M. Belbachir, A. Rahmouni, C. Derail, F. Hannaoui, F. Z. Zeggai, R. Chebout, and K. Bachari, "Improvement of the viscoelastic and thermal properties of polyvinyl acetate reinforced with organophilic clay (Algerian MMT)," Journal of Molecular Structure, vol. 1252, p. 132100, 2022.
E.-S. M. Sherif, M. Es-saheb, Z. AhmedEl, E.-R. Kenawyand, and A. S. Alkaraki, "coating electrospun polyvinyl alcohol and polyvinyl chloride fibers as corrosion passivation applications," International Journal of Electrochemical Science, vol. 7, no. 7, pp. 6154-6167, 2012.
G. Torres, C. R. Apesteguía, and J. I. Di Cosimo, "One-step methyl isobutyl ketone (MIBK) synthesis from 2-propanol: Catalyst and reaction condition optimization," Applied Catalysis A: General, vol. 317, no. 2, pp. 161-170, 2007.
S. Choopun, D. Wongratanaphisan, A. Gardchareon, P. Pimpang, and M. Thepnurat, "Preparation of micrometer-fine powder by milling process using ultrasonic wave-assisted vibrating liquid media," Thai Patent Appl. 1601000074, Jan. 9, 2016.
S. Wongrerkdee, and P. Pimpang, "Ultraviolet‐shielding and water resistance properties of graphene quantum dots/ polyvinyl alcohol composite-based film," Journal of Metals, Materials and Minerals, vol. 30, no. 4, pp. 90-96, 2020.
S. Wongrerkdee, and P. Pimpang, "Fluorescence quenching probe based on graphene quantum dots for detection of copper ion in water," Integrated Ferroelectrics, vol. 222, no. 1, pp. 56-68, 2022.
S. Wei, V. Pintus, and M. Schreiner, "Photochemical degradation study of polyvinyl acetate paints used in artworks by Py–GC/MS," Journal of Analytical and Applied Pyrolysis, vol. 97, pp. 158-163, 2012.
R. Bodîrlău, C. A. Teacă, and I. Spiridon, "Preparation and characterization of composites comprising modified hardwood and wood polymers/poly(vinyl chloride)," Bioengineering and Resuscitation, vol. 4, no. 4, pp. 1285-1304, 2009.
H. U. Khan, M. T. Jan, M. Iqbal, M. Shah, I. Ullah, J. Khan, K. Mahmood, A. Niaz, and M. Tariq, "Synthesis, characterization and electrical conductivity of silver doped polyvinyl acetate/ graphene nanocomposites: A Novel humidity sensor," Zeitschrift Physical Chemistry, vol. 234, no. 1, pp. 1-17, 2019.
S. Roy, S. Mishra, P. Yogi, S. K. Saxena, V. Mishra, P. R. Sagdeo, and R. Kumar, "Polypyrrole–vanadium oxide nano-composite: polymer dominates crystallanity and oxide dominates conductivity," Applied Physics A, vol. 124, no. 1, p. 53, 2017.
A. I. Oje, A. A. Ogwu, M. Mirzaeian, N. Tsendzughul, and A. M. Oje, "Pseudo-capacitance of silver oxide thin film electrodes in ionic liquid for electrochemical energy applications," Journal of Science: Advanced Materials and Devices, vol. 4, no. 2, pp. 213-222, 2019.
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