Investigation of deposition parameters on the structural properties and hardness of TiAlN films deposited via reactive pulsed DC magnetron sputteringInvestigation of deposition parameters on structural properties and hardness of TiAlN films deposited by reactive pulsed DC magnetron sputtering
Keywords:Magnetron sputtering, TiAlN film, Nitrogen gas flow rate, Bias voltage
In this work, titanium aluminum nitride (TiAlN) films were deposited on a silicon substrate via reactive pulsed DC magnetron sputtering. The effect of deposition parameters such as nitrogen gas flow rate, substrate temperature, and bias voltage on the structural and mechanical properties of TiAlN films was investigated. The crystal structure, morphology, and hardness of TiAlN films were characterized via X-ray diffraction (XRD), field emission scanning electron microscope (FE-SEM, and nanoindentation. An improved crystallinity of TiAlN films was obtained by varying the substrate temperature and bias voltage. The morphology of the TiAlN film exhibited a columnar structure, and the morphology gradually changed with the increase in bias voltage. The films thickness decreased upon increasing the nitrogen gas flow rate, substrate temperature, and bias voltage. In addition, the hardness of the TiAlN film was enhanced by adjusting the nitrogen gas flow rate, substrate temperature, and bias voltage, and a suitable elemental component ratio was obtained. A maximum hardness of approximately 28.9 GPa was obtained for the TiAlN film with a nitrogen gas flow rate of 4 sccm, substrate temperature of 500ºC, bias voltage of 100 V, and an elemental composition Al/(Al + Ti) of approximately 34.35%.
J. Shi, C. M. Muders, A. Kumar, X. Jiang, Z. L. Pei, J. Gong, and C. Sun, “Study on nanocomposite Ti-Al-Si-Cu-N films with various Si contents deposited by cathodic vacuum arc ion plating,” Applied Surface Science, vol. 258, pp. 9642-9649, 2012.
F. Mei, N. Shao, L. Wei, and G. Li, “Effect of N2 partial pressure on the microstructure and mechanical properties of reactively sputtered (Ti,Al)N coatings,” Materials Letters, vol. 59, pp. 2210-2213, 2005.
G. Hakansson, J. E. Sundgren, D. McIntyre, J. E. Greene, and W. D. Munz, “Microstructure and physical properties of poly-crystalline metastable Ti0.5Al0.5N alloys grown by d.c. magnetron sputter deposition,” Thin Solid Films, vol. 153, pp. 55-65, 1987.
T. Gredic, and M. Zlatanovic, “Plasma deposition of (Ti,Al)N coatings at various magnetron discharge power levels,” Surface and Coatings Technology, vol. 48, pp. 25-30, 1991.
R. Jalali, M. Parhizkar, H. Bidadi, H. Naghshara, and S. Hosseini, “Effect of Al content, substrate temperature and nitrogen flow on the reactive magnetron co-sputtered nanostructure in TiAlN thin films intended for use as barrier material in DRAMs,” Journal of the Korean Physical Society, vol. 66, pp. 978-983, 2015.
F. Ali, B. S. Park, and J. S. Kwak, “The impact of surface morphology on TiAlN film’s properties,” Journal of Ceramic Processing Research, vol. 14, pp. 529-534, 2013.
X. Wang, K. Zhang, G. Yue, D. Peng, Z. Qi, and Z. Wang, “Investigation on the structure and properties of TiAlN coatings deposited by DC reactive magnetron sputtering,” Advanced Materials Research, vol. 154-155, pp. 1639-1642, 2011.
N. Ghobadi, M. Ganji, C. Luna, A. Arman, and A. Ahmadpourian, “Effects of substrate temperature on the properties of sputtered TiN thin films,” Journal of Materials Science: Materials in Electronics, vol. 27, pp. 2800-2808, 2016.
D. M. Devia, E. Restrepo-Parra, P. J. Arango, A. P. Tschiptschin, and J. M. Velez, “TiAlN coatings deposited by triode magnetron sputtering varying the bias voltage,” Applied Surface Science, vol. 257, pp. 6181-6185, 2011.
R. Wuhrer, and W. Y. Yeung, “A study on the microstructure and property development of d.c. magnetron cosputtered ternary titanium aluminium nitride coatings,” Journal of Materials Science, vol. 37, pp. 1993-2004, 2002.
L. Liua, L. Zhoub, W. Tang, Q. Ruan, X. Li, Z. Wu, A. M. Qasim, S. Cui, T. Li, X. Tian, R. K. Y. Fu, Z. Wu, and P. K. Chu, “Study of TiAlN coatings deposited by continuous high power magnetron sputtering (C-HPMS),” Surface and Coatings Technology, vol. 402, pp. 126315, 2020.
J. C. Oliveira, A. Manaia, J. P. Dias, A. Cavaleiro, D. Teer, and S. Taylor, “The structure and hardness of magnetron sputtered Ti-Al-N thin films with low N contents (42 at%),” Surface and Coatings Technology, vol. 200, pp. 6583-6587, 2006.
W. Tillmann, D. Grisales, D. Stangier, I. B. Jebara, and H. Kang, “Influence of the etching processes on the adhesion of TiAlN coatings deposited by DCMS, HiPIMS and hybrid techniques on heat treated AISI H11,” Surface and Coatings Technology, vol. 378, pp. 125075, 2019.
How to Cite
Copyright (c) 2021 Journal of Metals, Materials and Minerals
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.Authors who publish with this journal agree to the following terms:
- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal.